Processing substrates using a temporary carrier

ABSTRACT

A technique comprising: securing a device substrate ( 8 ) to a carrier ( 1 ) using one or more adhesive elements ( 6 ); forming electronic elements ( 10 ) on the device substrate with the device substrate thus secured to the carrier; and thereafter reducing the adhesion strength of at least one of the one or more adhesive elements to facilitate the release of the substrate from the carrier.

The present invention relates to a method of processing substrates. Inone embodiment, it relates to a method of processing flexible substratesin the production of flexible electronic devices.

Some electronic devices such as flexible displays use flexible polymersubstrates as the support for electronic elements such as an array ofTFTs.

One challenge with the production of such devices is to preventmisalignment of electronic elements caused by distortion of thesubstrate during processing. One technique aimed at reducing suchmisalignments is to subject the plastic (polymer) substrate to aprolonged bake before processing.

It is an aim of the present invention to provide an improved techniquefor reducing such misalignments.

The present invention provides a method, comprising: securing a devicesubstrate to a carrier using one or more adhesive elements; formingelectronic elements on the device substrate with the device substratethus secured to the carrier; and thereafter reducing the adhesionstrength of at least one of the one or more adhesive elements tofacilitate the release of the substrate from the carrier.

In one embodiment, the method further comprises: securing a substrate toa carrier using one or more adhesive elements; processing the substratewith the substrate thus secured to the carrier; and thereafter reducingthe adhesion strength of at least one of the one or more adhesiveelements to facilitate the release of the substrate from the carrier,wherein the substrate is secured to the carrier using an adhesive unitcomprising adhesive layers supported on opposite sides of a supportelement; and comprising preferentially reducing the adhesion strength ofthe adhesive layer between the support element and one of the substrateand carrier, and removing said one of the substrate and carrier from theadhesive unit without removing the other of the substrate and thecarrier from the adhesive unit.

In one embodiment, the method further comprises: preferentially reducingthe adhesion strength of the adhesive layer between the support elementand the substrate, and removing the substrate from the adhesive unitwithout removing the adhesive unit from the carrier.

In one embodiment, the method further comprises: thereafter reducing theadhesion strength of the adhesive layer between the support element andthe carrier, and removing the adhesive unit from the carrier.

In one embodiment, the method further comprises: reducing the adhesionstrength of the adhesive layer between the support element and said oneof the substrate and the carrier by heating the adhesive unit to a firsttemperature, and reducing the adhesion strength of the adhesive layerbetween the support element and the other of the substrate and thecarrier by heating the adhesive unit to a second temperature higher thanthe first temperature.

In one embodiment, the second temperature is higher than the firsttemperature by at least about 20 degrees C.

In one embodiment, the second temperature is higher than the firsttemperature by at least about 40 degrees C.

In one embodiment, the first temperature is in the range of 85 to 95degrees C.

In one embodiment, the second temperature is in the range of 130 to 170degrees C.

In one embodiment, the adhesive layers exhibit an adhesion strength ofat least 3 Newtons/20 mm before the heating.

In one embodiment, processing the substrate comprises forming one ormore electronic elements on the device substrate.

In one embodiment, the method further comprises: reducing the adhesionstrength of at least one of the adhesive elements or at least one of theadhesive layers by heating or by irradiation.

In one embodiment, the substrate or device substrate is a flexiblesubstrate, and the carrier is a glass carrier.

In one embodiment, the substrate or device substrate exhibits aco-efficient of thermal expansion of greater than about 10 ppm ofexpansion per degree C.

In one embodiment, the substrate or device substrate is more flexiblethan the carrier.

In one embodiment, the substrate or device substrate has a co-efficientof thermal expansion greater than that of the carrier.

In one embodiment, the substrate or device substrate is secured to thecarrier as part of a sheet of substrate or device substrate materialproviding a plurality of substrates or device substrates.

According to one embodiment, a dual adhesive element is provided that isable to adhere the substrate to the carrier during processing of thedevice, but then is able to release the substrate from the carrier whenrequired, during a single step, while avoiding both distortion anddamage to the substrate during processing, and further allows thecarrier to be reused.

According to one embodiment, the tackiness of an upper adhesive layer isable to be reduced when required, allowing the substrate to be releasedfrom the carrier, without any effects of degradation to the substrate.The dual adhesive element remains on the carrier, until a furtherincrease in temperature is used to reduce the tackiness of a loweradhesive layer of the dual adhesive element and facilitate the releaseof the dual adhesive element from the carrier.

A specific embodiment thereof will now be described by way of exampleand with reference to the accompanying drawings, in which:

FIG. 1 illustrates the securing a device substrate to a carrier inaccordance with an embodiment of the present invention using an adhesiveelement;

FIG. 2 illustrates pre-use protection of the adhesive element used inFIG. 1; and

FIG. 3 illustrates securing a plurality of device substrates to acarrier in accordance with an embodiment of the present invention usingan adhesive element.

In accordance with a first embodiment of the invention as illustrated inFIG. 1, a plurality of flexible device substrates 8 (only one is shownin FIG. 1) are secured to a rigid glass carrier 1 via an adhesiveelement 6. As discussed in more detail below, the electronic elements 10(such as the TFT array) are formed on the device substrate 8 after thedevice substrate 8 has been secured to the rigid glass carrier 1. Afterprocessing, the device substrate 8 is removed from the carrier 1. Theelectronic elements 10 are formed on the device substrate 8 via aplanarisation layer 9 deposited on the device substrate 8 after securingthe device substrate 10 to the carrier 1.

The processing of the device substrate includes a sequence of stepsincluding depositing material and removing deposited material. Suchdeposition and removal steps are controlled automatically on the basisof the expected position and configuration of the device substrate 8 onthe carrier 1. If the position of the device substrate 8 relative to thecarrier 1 and/or the configuration of the device substrate 8 on thecarrier 1 does not remain substantially constant for each of thesequence of steps, this can lead to misalignments and device failures.

The device substrate 8 may be a flexible substrate, such as an organicpolymer substrate, for supporting a TFT array 10 to serve as thebackplane of an LCD or electrophoretic display device. Examples ofplastic substrates for this use are organic polymer films such as filmsof heat-stabilised polyethyleneterephtalate (HS-PET) and films ofheat-stabilised polyethylenenaphtalene (HS-PEN).

The adhesive element 6 comprises a central polyester film supportelement 3 supporting two adhesive layers 2, 4. For the adhesive layers 2and 4 are used materials whose strength of adhesion for the carrier 1and device substrate 8 can be reduced by an external stimulus such asheating or UV irradiation. Under the conditions at which the devicesubstrate is processed in position on the carrier, the adhesive layersexhibit an adhesion strength sufficiently high to securely hold thedevice substrate 8 on the carrier during the processing of the substrateon the carrier.

The processing of the device substrate includes exposing the devicesubstrate to low pressure/vacuum conditions as part of the production ofthe TFT array 10, and the adhesion strength exhibited by the adhesivelayers for the carrier, support element and device substrate issufficiently high to prevent the device substrate 8 from bubbling up(lifting) under such low pressure/vacuum conditions. Bubbling-up of thesubstrate is undesirable because it can cause distortion in the z-axis(i.e. an axis perpendicular to the plane of the device substrate) duringprocessing, and can also cause distortion in the x-y axis (i.e. in adirection parallel to the plane of the device substrate 8) after areturn to normal pressure conditions, as the device substrate relaxesback down.

The processing of the device substrate 8 on the carrier also includessubjecting the device substrate to rises in temperature. Flexibleplastic substrates have a relatively high co-efficient of thermalexpansion (CTE), and rises in temperature during processing causeexpansion of the device substrate. The internal cohesive strength of theadhesive layers (and also the other layers/elements in the stack) aresufficiently high to return the device substrate 8 to substantially thesame X-Y position relative to the glass carrier upon a return to normaltemperature conditions in preparation for another processing step. Thisfurther helps to reduce or eliminate the misalignment oflayers/elements/components applied to or deposited on the devicesubstrate 8 as part of said another processing step.

After processing of the device substrate 8 on the carrier 1 iscompleted, the adhesive element 6 is subjected to the necessary externalstimulus to trigger a reduction in the adhesion strength of the adhesivelayers.

In accordance with this embodiment of the invention, the adhesivematerials for the two adhesive layers 2 and 4 are selected such that asignificant reduction in the adhesion strength can be triggered in theadhesive layer 4 adjacent to the device substrate 8 without triggering asignificant reduction in the adhesion strength of the adhesive layer 2adjacent to the carrier 1. It is found that this is advantageous forensuring complete and reliable removal of adhesive material from theundersurface of the device substrate 8.

Further in accordance with this embodiment of the invention, theadhesive material for the adhesive layer 2 adjacent to carrier 1 isfurther selected such that its adhesion strength can be significantlyreduced by the application of a further external stimulus. For example,the adhesive material for the adhesive layer 4 adjacent to the devicesubstrate 8 is one at which a significant reduction in adhesion strengthis first achieved in a short period (e.g. 3 seconds) at a relatively lowtemperature (e.g. between 85 and 95 degrees C. or about 90 degrees C.),and the adhesive material for the adhesive layer 2 adjacent to thecarrier 1 is one at which a significant reduction in adhesion strengthis first achieved in a short period (e.g. 3 seconds) at a highertemperature (e.g. between 130 and 170 degrees C. or about 150 degreesC.).

The selection of appropriate trigger temperatures will depend on thetemperatures that are reached during the processing of the devicesubstrate 8 on the carrier 1, and the amount of heat that the devicesubstrate 8 and the TFT array 7 formed thereon can withstand withoutsuffering a degradation of those elements and a deterioration in deviceperformance. It has been found that a temperature of between 85 to 95degrees C. or about 90 degrees C. is a suitable trigger temperature forthe adhesive layer 4 adjacent to the device substrate 8 for the case ofa TFT array including organic polymer materials for the semiconductingchannel and gate dielectric. An appropriate trigger temperature for theadhesive layer 2 adjacent to the carrier 1 is the lowest temperature atwhich it can be sure that the adhesive layer 2 adjacent to the carrier 1will not undergo a significant degree in adhesion strength at the timeof heating the adhesive layer 4 adjacent to the device substrate 8 totrigger a reduction in the adhesion strength of that adhesive layer. Ithas been found that a temperature of between 130 and 170 degrees C. orabout 150 degrees C. is a suitable trigger temperature for the adhesivelayer 2 adjacent to the carrier 1. In order to prevent a significantreduction in the adhesion strength of the adhesive layer adjacent to thecarrier 1 at the time of reducing the strength of the adhesive layeradjacent to the device substrate 8, the trigger temperature for theadhesive layer adjacent to the carrier 1 should be sufficiently higherthan the trigger temperature for the adhesive layer adjacent to thedevice substrate 8. A trigger temperature difference of least about 20degrees C., and more preferably at least about 40 degrees C. is found tobe effective for this purpose.

It has been found that this embodiment of the present invention can beimplemented by making the adhesive element using, for example, adhesivetapes commercially available from Nitto Denko under the product nameREVALPHA®. These tapes are found to exhibit an adhesion strength of atleast 3 N/20 mm (as measured in accordance with the JIS Z-0237 standard(Surface material: S/S board, Peeling speed: 300 mm/min, Peeling angle:180°) for the glass carrier 1 and a PET device substrate 8 at thetemperatures under processing of the device substrate 8 to form the TFTarray 10 takes place. This level of adhesion strength is found to besufficient to reliably hold the device substrate 8 in place on thecarrier 1 and substantially prevent distortions of the kind that mightcause misalignments of the various elements deposited on the devicesubstrate 8 to form the TFT array 10. These tapes are available indifferent types exhibiting a reduction in adhesion strength at differenttemperatures. It has been found that the 90 degree C. type is suitablefor the adhesive layer 4 adjacent to the device substrate 8 and that the150 degree C. type is suitable for the adhesive layer 2 adjacent to thecarrier 1.

As shown in FIG. 2, the tapes are provided with upper and lower liners 5a, 5 b that provide pre-use protection for the adhesives layer 2 and 4.These liners 5 a, 5 b are removed from the adhesive element 6 before theadhesive element 6 is used to secure the device substrate 8 to thecarrier 1.

To secure the device substrate 8 to the carrier 1: firstly, the lowerliner (5 a) is first removed from the adhesive element 6, and theexposed lower adhesive layer 2 is pressed onto the carrier 1 to securethe adhesive element 6 to the carrier 1; and, the upper liner 5 b isthen removed from the adhesive element 6, and the device substrate 8 ispressed down onto the exposed upper adhesive layer 4.

Processing of the device substrate 8 then takes place. For the exampleof an organic polymer TFT array, this includes the sputter depositionand patterning of upper and lower metal layers to define the source,drain and gate electrodes and addressing lines/interconnects; and thedeposition from solution of an organic polymeric semiconductor materialto form the semiconducting channel between the source and drainelectrodes of each TFT and the deposition from solution of an organicpolymeric dielectric material to form the gate dielectric between thesemiconducting channel and gate electrode of each TFT.

After the processing of the device substrate on the carrier is completed(and the TFT array 10 is formed on the device substrate 8), the devicesubstrate 8 is released from the adhesive element by mounting the rigidglass carrier 1 on a hot plate at an appropriate temperature to triggera reduction in the adhesion strength of the adhesive layer 4 adjacent tothe device substrate 8 without triggering a significant reduction in theadhesion strength of the adhesive layer 2 adjacent to the carrier 1.After removal of the device substrate 8 from the carrier 1, the carrier1 is heated to a higher temperature to reduce the adhesion strength ofthe adhesive layer 2 adjacent to the carrier 1 and release the carrier 1from the adhesive element 6, thereby facilitating reuse of the carrier1.

The time that it takes to heat the adhesive layers to the releasetemperature will depend on the speed at which the heat can betransferred to the adhesive layer. Because of the thermal lag caused bythe assembly in which the adhesive layers reside, it may takesignificantly longer to heat the adhesive layer to the respectiverelease temperature, For example, it may take about 30 seconds, or asmuch as 105 seconds or 180 seconds.

According to one variation of the above-mentioned technique, adhesivematerials are used for which a reduction in adhesion strength can beachieved by UV irradiation. This alternative technique is of particularuse where the device substrate 8 or the TFTs 10 formed thereon are notdegraded or damaged by exposure to UV radiation, and/or where theelements formed on the device substrate by processing on the carrierinclude heat-sensitive elements. For example, one or both of theadhesive layers 2, 4 in the technique described above could be replacedwith a UV peeling tape such as those commercially available from NittoDenko. Replacing only one of the adhesive layers 2, 4 with a UV peelingtape facilitates the selective removal of one of the carrier 1 and thedevice substrate 8 from the adhesive element 6. For example, if only theadhesive layer 2 adjacent to the carrier 1 is replaced with a UV peelingtape, the device substrate could be removed from the adhesive element byheating as described above, and exposure of UV irradiation from thebottom would allow the carrier 1 to be removed from the adhesive elementwithout damage. Alternatively, a UV peeling tape could be usedselectively adjacent to the device substrate 8 to facilitate removal ofthe device substrate 8 from the adhesive element 6 by exposure to UVradiation, and heating could be used as described above to subsequentlyrelease the adhesive element 6 from the carrier 1.

With the above-described technique, it is possible to suppress theeffect of linear expansion changes in the plastic device substrate 8during processing, as well as resist non-linear (random) distortions inthe plastic device substrate 8 during processing, which non-lineardistortions can arise because of defects or abnormalities in thestructure of the plastic substrate. As mentioned above, the highadhesion strength and cohesive strength of the adhesive layers serve toprevent undesirable changes in the position of the device substrate 8relative to the glass carrier 1, which itself has a very lowco-efficient of thermal expansion in the range of 3 to 5 ppm expansionper degree C.

The above-described technique makes it possible to: (a) improve yieldsby reducing misalignments; (b) facilitate the production of highresolution displays; and (c) reduce manufacturing costs because lessdistortion implies less critical alignment (e.g., less local alignmentsteps).

We have chosen the example of producing an organic polymer TFT array todescribe techniques in accordance with embodiments of the invention, butthe same kind of techniques are also applicable to the production ofother kinds of devices including a flexible plastic support substrate.

Also, we have chosen to illustrate the invention in FIG. 1 withreference to the securing and processing of an individual devicesubstrate to a rigid carrier. However, the techniques described aboveare equally applicable to the securing and processing of a plurality ofdevice substrates on a common rigid carrier. For example, according toone variation illustrated in FIG. 3, the adhesive element 6 is used inthe form of a relatively large area sheet to secure a sheet of devicesubstrate material to a carrier 1. The sheet of device substratematerial provides a plurality of device substrates (two are shown inFIG. 3). A planarisation layer 9 is formed over the entire surface ofthe device substrate material sheet 2, and then a plurality of displaydevice products are formed on respective regions of the sheet of devicesubstrate material 2. After the processing is completed, the devicesubstrate material sheet and underlying adhesive element sheet 6 is cutin a region between the device substrate regions, and the plurality ofindividual device substrates are removed from the respective adhesiveelement patches in the same way as described above in relation to FIG.1; and the adhesive element patches left adhered to the carrier 1 arealso removed from the carrier in the same way as described above inrelation to FIG. 1.

The invention is not limited to the above-described examples andembodiments. It will be evident to a person skilled in the art thatvarious modifications may be made within the scope of the invention.

The applicant hereby discloses in isolation each individual featuredescribed herein and any combination of two or more such features, tothe extent that such features or combinations are capable of beingcarried out based on the present specification as a whole in the lightof the common general knowledge of a person skilled in the art,irrespective of whether such features or combinations of features solveany problems disclosed herein, and without limitation to the scope ofthe claims. The applicant indicates that aspects of the presentinvention may consist of any such individual feature or combination offeatures.

1. A method, comprising: securing a device substrate to a carrier usingone or more adhesive elements; forming electronic elements on the devicesubstrate with the device substrate thus secured to the carrier; andthereafter reducing the adhesion strength of at least one of the one ormore adhesive elements to facilitate the release of the substrate fromthe carrier.
 2. A method, comprising: securing a substrate to a carrierusing one or more adhesive elements; processing the substrate with thesubstrate thus secured to the carrier; and thereafter reducing theadhesion strength of at least one of the one or more adhesive elementsto facilitate the release of the substrate from the carrier, wherein thesubstrate is secured to the carrier using an adhesive unit comprisingadhesive layers supported on opposite sides of a support element; andcomprising preferentially reducing the adhesion strength of the adhesivelayer between the support element and one of the substrate and carrier,and removing said one of the substrate and carrier from the adhesiveunit without removing the other of the substrate and the carrier fromthe adhesive unit.
 3. The method according to claim 2, comprising:comprising preferentially reducing the adhesion strength of the adhesivelayer between the support element and the substrate, and removing thesubstrate from the adhesive unit without removing the adhesive unit fromthe carrier.
 4. The method according to claim 3, comprising: thereafterreducing the adhesion strength of the adhesive layer between the supportelement and the carrier, and removing the adhesive unit from thecarrier.
 5. The method according to claim 2, comprising: reducing theadhesion strength of the adhesive layer between the support element andsaid one of the substrate and the carrier by heating the adhesive unitto a first temperature, and reducing the adhesion strength of theadhesive layer between the support element and the other of thesubstrate and the carrier by heating the adhesive unit to a secondtemperature higher than the first temperature.
 6. The method accordingto claim 5, wherein the second temperature is higher than the firsttemperature by at least about 20 degrees C.
 7. The method according toclaim 6, wherein the second temperature is higher than the firsttemperature by at least about 40 degrees C.
 8. The method according toclaim 5, wherein the first temperature is in the range of 85 to 95degrees C.
 9. The method according to claim 5, wherein the secondtemperature is in the range of 130 to 170 degrees C.
 10. The methodaccording to claim 5, wherein the adhesive layers exhibit an adhesionstrength of at least 3 Newtons/20 mm before the heating.
 11. The methodaccording to claim 2, wherein processing the substrate comprises formingone or more electronic elements on the device substrate.
 12. The methodaccording to claim 1, comprising: reducing the adhesion strength of atleast one of the adhesive elements or at least one of the adhesivelayers by heating or by irradiation.
 13. The method according to claim1, wherein the substrate or device substrate is a flexible substrate,and the carrier is a glass carrier.
 14. The method according to claim 1,wherein the substrate or device substrate exhibits a co-efficient ofthermal expansion of greater than about 10 ppm of expansion per degreeC.
 15. The method according to claim 1, wherein the substrate or devicesubstrate is more flexible than the carrier.